Sputter deposition apparatus for coating a substrate and method for performing a sputter deposition process

摘要

A sputter deposition apparatus is provided. The sputter deposition apparatus includes a plurality of cathode assemblies configured to sputter a target material in a sputter deposition process, each of the plurality of cathode assemblies including a rotating target and a magnet assembly disposed within the rotating target. , The plurality of cathode assemblies includes an outermost cathode assembly. The sputter deposition apparatus further includes a plurality of anode elements configured to affect a plasma generated in the sputter deposition process, wherein the plurality of anode elements include an outermost anode element. The sputter deposition apparatus further includes an auxiliary magnet assembly. The outermost cathode assembly, the outermost anode element, and the auxiliary magnet assembly are arranged in this order, and the auxiliary magnet assembly is configured to apply a magnetic field to correct for boundary effects in the outer region of the plasma. Have been. [Selection diagram] Fig. 1