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PRESS PIN AMD SEMICONDUCTOR PACKAGE HAVING THE SAME
PRESS PIN AMD SEMICONDUCTOR PACKAGE HAVING THE SAME
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机译:按相同方式的AMD AMD半导体封装
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摘要
The press-fit pin according to the present invention is for increasing the contact area with the contact hole to provide an appropriate contact pressure, reduce the contact resistance, and increase the heat transfer efficiency. And a press portion extending from the end portion and being formed by branching to a first press-fit piece and a second press-fit piece, wherein the first press-fit piece has a first press- And the second press-fit piece is formed to be bent in a second direction perpendicular to the direction of the press-fit pin and in a direction of 30 to 110 degrees with respect to the first direction, and the second press- And a fourth direction perpendicular to the direction of the press pit pin and in a third direction that is 180 degrees to the first direction and perpendicular to the direction of the press pit pin, As shown in FIG.
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