首页> 外国专利> PRESS PIN AMD SEMICONDUCTOR PACKAGE HAVING THE SAME

PRESS PIN AMD SEMICONDUCTOR PACKAGE HAVING THE SAME

机译:按相同方式的AMD AMD半导体封装

摘要

The press-fit pin according to the present invention is for increasing the contact area with the contact hole to provide an appropriate contact pressure, reduce the contact resistance, and increase the heat transfer efficiency. And a press portion extending from the end portion and being formed by branching to a first press-fit piece and a second press-fit piece, wherein the first press-fit piece has a first press- And the second press-fit piece is formed to be bent in a second direction perpendicular to the direction of the press-fit pin and in a direction of 30 to 110 degrees with respect to the first direction, and the second press- And a fourth direction perpendicular to the direction of the press pit pin and in a third direction that is 180 degrees to the first direction and perpendicular to the direction of the press pit pin, As shown in FIG.
机译:根据本发明的压配销用于增加与接触孔的接触面积,以提供适当的接触压力,减小接触电阻,并提高热传递效率。以及从端部延伸并通过分支形成到第一压配合件和第二压配合件的压紧部,其中第一压配合件具有第一压紧部,并且第二压配合件形成在垂直于压配合销的方向的第二方向上以及相对于第一方向和第二压榨方向以30至110度的方向弯曲销钉并沿与第一方向成180度并垂直于压坑销钉的方向的第三方向。

著录项

  • 公开/公告号KR101942812B1

    专利类型

  • 公开/公告日2019-01-29

    原文格式PDF

  • 申请/专利权人 제엠제코(주);

    申请/专利号KR20170090821

  • 发明设计人 최윤화;최순성;조정훈;

    申请日2017-07-18

  • 分类号H01R12/70;H01L23/495;H01L23/498;

  • 国家 KR

  • 入库时间 2022-08-21 11:49:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号