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-- STRAINED GATE-ALL-AROUND SEMICONDUCTOR DEVICES FORMED ON GLOBALLY OR LOCALLY ISOLATED SUBSTRATES

机译:-遍布全球或局部隔离的基带的应变全周导通半导体器件

摘要

A modified gate-all-around semiconductor device formed on a fully or locally isolated substrate is described. For example, a semiconductor device includes a semiconductor substrate. The insulating structure is disposed on the semiconductor substrate. The three-dimensional channel region is disposed over the insulating structure. The source and drain regions are disposed on either side of the three-dimensional channel region and on the epitaxial seed layer. The epitaxial seed layer is comprised of a semiconductor material that is different from the three dimensional channel region and disposed on the insulating structure. The gate electrode stack is partially disposed on the insulating structure and laterally adjacent to the epitaxial seed layer to surround the three dimensional channel region.
机译:描述了形成在完全或局部隔离的衬底上的改进的环绕栅半导体器件。例如,半导体器件包括半导体衬底。绝缘结构设置在半导体衬底上。三维沟道区设置在绝缘结构上方。源极区和漏极区设置在三维沟道区的任一侧和外延种子层上。外延种子层由与三维沟道区不同的半导体材料构成,并设置在绝缘结构上。栅电极叠层部分地设置在绝缘结构上并且在横向上与外延种子层相邻以包围三维沟道区。

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