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LED LED Metal frame for LED heat dissipation package and the LED package using the same

机译:用于LED散热封装的LED LED金属框架以及使用该金属框架的LED封装

摘要

The present invention relates to a metal heat dissipating frame and an LED package using the metal heat dissipating frame. More particularly, the present invention relates to a metal heat dissipating frame structure for rapidly diffusing and radiating heat concentrated in a heat slug, and an LED package using the same. According to another aspect of the present invention, there is provided a metal heat dissipation frame including: a heat dissipation panel including a heat dissipation start part receiving heat and a heat dissipation diffusion part extending from the heat dissipation start part to diffuse and dissipate heat; And a plurality of electrode panels disposed facing the heat dissipation start part and separated from the heat dissipation panel. According to another aspect of the present invention, there is provided an LED package including: a metal heat dissipation frame; A heat slug attached to the heat radiation starting portion, and an electrode terminal bonded to the electrode panel.
机译:金属散热框架和使用该金属散热框架的LED封装技术领域本发明涉及金属散热框架和使用该金属散热框架的LED封装。更具体地,本发明涉及用于快速扩散和散发集中在散热块中的热量的金属散热框架结构,以及使用该金属散热框架结构的LED封装。根据本发明的另一方面,提供了一种金属散热框架,该金属散热框架包括:散热面板,其包括:散热开始部分,其接收热量;以及散热扩散部分,其从所述散热开始部分延伸以扩散和散热。并且,多个电极面板面对散热开始部分设置并且与散热面板分开。根据本发明的另一个方面,提供了一种LED封装,其包括:金属散热框架;以及散热装置。散热块附接到散热开始部分,并且电极端子粘接到电极面板。

著录项

  • 公开/公告号KR101973594B1

    专利类型

  • 公开/公告日2019-04-30

    原文格式PDF

  • 申请/专利权人 주식회사 폴라리스;

    申请/专利号KR20160108601

  • 发明设计人 최원희;

    申请日2016-08-25

  • 分类号H01L33/64;H01L33/22;H01L33/36;H01L33/48;H01L33/62;

  • 国家 KR

  • 入库时间 2022-08-21 11:48:39

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