首页> 外国专利> SERIES METAL HEAT DISSIPATION PART FOR LED PACKAGE, AND FRAME AND LED PACKAGE USING SAME

SERIES METAL HEAT DISSIPATION PART FOR LED PACKAGE, AND FRAME AND LED PACKAGE USING SAME

机译:LED封装用系列金属散热部件,以及使用该金属散热片的框架和LED封装

摘要

The present invention relates to a series metal heat dissipation part for an LED package, and a frame and an LED package using the same and, more specifically, to a series metal heat dissipation part for an LED package, and a frame and an LED package using the same which quickly disperse heat concentrated on a heat slug of an LED module to dissipate the heat. According to a proper embodiment of the present invention, the series metal heat dissipation part for an LED package includes two or more heat dissipation units (100) to be connected. The heat dissipation unit (100) comprises: a heat dissipation panel (10) including a heat dissipation start part (11) to receive heat and a heat dissipation dispersion part (12) extended from the heat dissipation start part (11) to disperse and dissipate heat; and a plurality of electrode panels (20, 30) arranged to face each other while arranging the heat dissipation start part (11) therebetween, and separated from the heat dissipation panel (10). A gap between the heat dissipation unit (100) and an adjacent heat dissipation unit (100′) is connected to form the heat dissipation start part (11). The heat dissipation dispersion parts (12) of the heat dissipation unit (100) and the adjacent heat dissipation unit (100′) are connected to each other. And the series metal heat dissipation part for an LED package can be used to construct a frame and an LED package.;COPYRIGHT KIPO 2018
机译:技术领域本发明涉及一种用于LED封装的串联金属散热部件,以及使用该串联金属散热部件的框架和LED封装,更具体地,涉及一种用于LED封装的串联金属散热部件,以及框架和LED封装。使用可快速散布集中在LED模块散热块上的热量的散热装置。根据本发明的适当实施例,用于LED封装的串联金属散热部件包括两个或多个要连接的散热单元(100)。散热单元(100)包括:散热面板(10),其包括用于接收热量的散热开始部分(11)和从散热开始部分(11)延伸以分散并散布的散热部分(12)。散热多个电极板(20、30)在将散热开始部(11)配置于它们之间的状态下相对配置,并与散热板(10)分离。连接散热单元(100)和相邻的散热单元(100)之间的间隙以形成散热开始部分(11)。散热单元(100)的散热分散部(12)与相邻的散热单元(100′)相互连接。而且LED封装的系列金属散热部件可用于构建框架和LED封装。; COPYRIGHT KIPO 2018

著录项

  • 公开/公告号KR20180030290A

    专利类型

  • 公开/公告日2018-03-22

    原文格式PDF

  • 申请/专利权人 POLARIS;

    申请/专利号KR20160117322

  • 发明设计人 CHIOI WON HEEKR;

    申请日2016-09-12

  • 分类号H01L33/64;H01L33/36;

  • 国家 KR

  • 入库时间 2022-08-21 12:40:32

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