Highly adaptive light sources are demanded in many applications, e.g. in medical technology, in the workplace environment and in the automotive and traffic sectors. To achieve high light outputs and system efficiencies, an optimization of every aspect of the LED packaging is necessary, especially the aspect of heat dissipation. Therefore we present a concept for a highly integrated LED packaging for a micro LED array. Due to a smart combination and optimization of different technologies, materials and new heat paths, heat transfer out of the chip is maximized.
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