Copper Copper METHOD FOR THE CONTINUOUS PRODUCTION OF COPPER TRANSPARENT ELECTRODE CIRCUIT FILM USING MOLD AND THE COPPER TRANSPARENT ELECTRODE CIRCUIT FILM PREPARED THEREFROM

摘要

According to the present invention, a method for continuously producing a copper transparent electrode circuit film using a mold comprises the steps of: immersing a metal mold plate in a copper plating solution for plating with copper; stacking a transparent film on the metal mold plate plated with copper to thermally compress so as to perform lamination to transfer copper of a circuit pattern; separating the metal plate and the laminated transparent film to obtain a transparent electrode circuit film; cleaning the metal mold plate used to manufacture the transparent electrode circuit film; and continuously repeating a series of processes. Accordingly, unlike the existing method, mass production by continuous processing is possible.