- - METAL-RESIN ADHESION STRUCTURE AND METHOD FOR MANUFACTURING THE STRUCTURE AND CIRCUIT BOARD AND COPPER CLAD LAMINATE WITH THE STRUCTURE

摘要

A metal-resin bonded structure according to an embodiment of the present invention includes a resin layer, a metal layer bonded to the resin layer, and a metal layer bonded to the resin layer and the metal layer, Lt; RTI ID = 0.0 a / RTI silane-based coupling agent.