首页>
外国专利>
Metal-resin bonding structure and manufacturing method thereof, and circuit board and copper-clad laminate having the metal-resin bonding structure
Metal-resin bonding structure and manufacturing method thereof, and circuit board and copper-clad laminate having the metal-resin bonding structure
The present invention discloses a metal-resin adhesion structure, a circuit board and a copper cladding foil layer including metal-resin adhesion structure, and a method for making the same metal-resin adhesion structure. According to the present invention, the meta-resin adhesion structure comprises a resin layer, a metal layer attached to the resin layer, and a modified layer that is disposed on the attaching surface between the resin layer and the metal layer, and comprises a silane coupling agent to provide adhesion between the resin layer and the metal layer.
展开▼