METHODS OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A STAIR STEP STRUCTURE AND RELATED SEMICONDUCTOR DEVICES

摘要

A method of forming a semiconductor device structure includes forming a stack structure over a substrate, the stack structure comprising layers that each independently include a sacrificial structure and an insulating structure longitudinally adjacent to the sacrificial structure. The masking structure is formed over a portion of the stack structure. The photoresist is formed over the masking structure and over an additional portion of the stack structure not covered by the masking structure. The photoresist and stack structure may be a series of layers to selectively remove portions of the photoresist and portions of the stack structure not covered by the one or more masking structures, leaving a remainder of the photoresist to form a step step structure. Undergo a material removal process. Semiconductor devices and additional methods of forming semiconductor device structures are also described.