WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER ENTRY INTO ELECTROPLATING BATH

摘要

The method described herein allows the electrolyte to be moved in such a way that air capture due to the initial impact of the wafer and / or wafer holder and electrolyte is reduced and the electrolyte wet wavefront is maintained while minimizing air capture throughout the immersion of the wafer. Manage wafer acquisition into the furnace.