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Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
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机译:润湿波前控制可减少晶圆进入电镀槽时的空气夹带
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摘要
Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
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