CHIP CARD MODULE, METHOD FOR PRODUCING A CHIP CARDS MODULE, CHIP CARD AND METHOD FOR CHECKING A CHIP CARDS MODULE

摘要

In various embodiments, a smart card module is provided. The chip card module can have a carrier and a layer stack at least partially covering the carrier. The layer stack may comprise a reflective layer, a light-transmissive layer disposed over the reflective layer, and a light-transmissive silver layer disposed over the light-transmissive layer and configured to reflect a portion of incident light thereon.