Chip card module arrangement, chip card, method for producing a chip card module arrangement and method for producing a chip card

摘要

A method of manufacturing a smart card module assembly (200a), the method comprising: placing a smart card module (206) on a first carrier layer (202a), the first carrier layer (202a) being free from a prefabricated smart card module receiving recess for receiving the smart card module (206) and wherein the smart card module (206) comprises: a substrate (206s); a chip (206c) on the substrate (206s); a first mechanical reinforcement structure (206v) between the chip (206c) and the substrate (206s), the first mechanical reinforcement structure (206v) covering at least a portion of a surface of the chip (206c); Depositing a second carrier layer (202b) on the smart card module (206), the second carrier layer (202b) being free of a prefabricated smart card module receiving recess for receiving the smart card module (206); and laminating and / or compressing the first carrier layer (202a) with the second carrier layer (202b) such that the smart card module (206) is enclosed by the first carrier layer (202a) and the second carrier layer (202b); wherein the smart card module (206) further comprises a second mechanical reinforcing structure (306v) on a side of the substrate (206s) opposite to the side on which the first mechanical reinforcing structure (206v) is disposed to reinforce and / or stabilize an area (306s ) of the substrate (206s); and wherein the chip (206c) is disposed over the reinforced and / or stabilized region (306s) of the substrate (206s).