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Method for passivating a surface of a semiconductor material and semiconductor substrate

机译:钝化半导体材料的表面的方法和半导体衬底

摘要

A method for passivating a surface of a semiconductor material includes forming a layer stack having an aluminum oxide layer and an outer coating on the surface of the semiconductor material. The aluminum oxide layer and the outer coating are respectively formed in vacuum processes in which a vacuum is present. The vacuum is maintained between the forming of the aluminum oxide layer and the forming of the outer coating. Hydrogen and oxygen are supplied after the forming of the aluminum oxide layer and before the forming of the outer coating. A semiconductor substrate is also provided.
机译:一种使半导体材料的表面钝化的方法,包括在半导体材料的表面上形成具有氧化铝层和外涂层的叠层。氧化铝层和外涂层分别在存在真空的真空工艺中形成。在氧化铝层的形成和外涂层的形成之间保持真空。在氧化铝层形成之后并且在外涂层形成之前供应氢和氧。还提供了半导体衬底。

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