PRESSURE SENSITIVE ADHESIVE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE IN FLEXIBLE ORGANIC LIGHT EMITTING DIODE APPLICATIONS

摘要

A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective film is useful in flexible OLED device fabrication processes, e.g., for protection of passivation layers.