Pressure sensitive adhesive compositions and manufacturing methods for preparing them and use in flexible organic light emitting diode applications

摘要

The pressure-sensitive adhesive composition can be cured through hydrosilylation to form a pressure-sensitive adhesive. The pressure-sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film is useful in a flexible OLED device manufacturing process, for example, for the protection of a passivation layer.