Polishing pad, manufacturing method of polishing pad, method of polishing the surface of optical material or semiconductor material, and evaluation method of polishing pad

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad which suppresses polishing scratches, has little fluctuation in polishing rate during polishing, and has excellent polishing stability. SOLUTION: The polishing pad has a polishing layer containing a polyurethane resin, and the polishing layer obtains a free induction decay signal (FID) obtained by pulse NMR from a component having a long spin-spin relaxation time T2 by a minimum square method. By subtracting in order and separating the waveforms, when the spin-spin relaxation time T2 is divided into three components in order from the longest one, the amorphous phase, the interface phase, and the crystalline phase, the content ratio (Ac) of the crystalline phase component at 20 ° C. ₂₀ ) is 10 to 20%, and the content ratio (Ai ₂₀ ) of the interface phase component at 20 ° C. is 40 to 50%. [Selection diagram] Fig. 5