Polishing pad, manufacturing method of polishing pad, method for polishing optical material or surface of semiconductor material, and evaluation method of polishing pad

摘要

Problem to be solved: to provide a polishing pad capable of suppressing the occurrence of scratches derived from the pad debris, a method of manufacturing the polishing pad, a method of polishing the surface of an optical material or a semiconductor material using the polishing pad, and an evaluation method of the polishing pad.A polishing pad having a polishing layer containing a polyurethane resinPolyurethane resinIsocyanate terminated urethane prepolymer and cured curable resin composition comprising a curing agent;The polishing layerIt is obtained by measuring the particle size distribution of the sample containing the scraper of the polishing layer after the abrasion test carried out under the following conditions.The cumulative particle size in the volume integrated particle size distribution is μ M or lessPolishing pad.No selection