Ultrasonic Bonding Equipment, Ultrasonic Bonding Structures, Ultrasonic Bonding Methods and Manufacturing Methods for Semiconductor Devices

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding apparatus and an ultrasonic bonding method capable of stably ultrasonically bonding a material to be bonded and a bonding material via an insert material without shifting the position of the insert material. Also provided are an ultrasonic bonding structure by the ultrasonic bonding device and a method of manufacturing a semiconductor device by the ultrasonic bonding method. SOLUTION: The ultrasonic bonding device includes a fixing base, a horn 2, and an exclusion prevention mechanism 3. The fixing base fixes the material 101 to be joined. The horn 2 oscillates ultrasonic waves while pressing the bonding material 102 to be bonded to the material to be bonded 101 via the insert material 103. The exclusion prevention mechanism 3 can sandwich at least a part of the insert material 103 from the side when the fixing base is viewed in a plan view. [Selection diagram] FIG. 14