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Electronic component transfer device, electronic component inspection device, supply transfer method, and recovery transfer method

机译:电子零件移载装置,电子零件检查装置,供给移载方法及回收移载方法

摘要

PROBLEM TO BE SOLVED: To provide an electronic component transporting apparatus, an electronic component inspecting apparatus, a supply transporting method, and a collecting transporting method, each of which has a container for accommodating a plurality of trays and has a small installation area. An electronic component transfer device (10) that transfers an IC device (90) as an electronic component housed in a tray (200) as a container to an inspection unit (16) that inspects the electrical characteristics of the IC device (90). The mounting portion 30 on which the tray 200 in which the IC device 90 before being inspected according to is mounted is mounted, the accommodating unit 2 that accommodates the tray 200 and moves the tray 200 along the horizontal axis, and along the vertical axis. The tray 5 mounted on the mounting unit 30 and the transfer unit 3 that transfers the tray 200 from the container 2 to the elevator 5, and the tray 200 mounted on the mounting unit 30 to the inspection unit 16. And a carrying section 25 for carrying the IC device 90, and the housing machine 2 is arranged at a position overlapping the carrying section 25 when the housing machine 2 is viewed in plan. [Selection diagram] Figure 1
机译:解决的问题:提供一种电子部件输送设备,电子部件检查设备,供应输送方法和收集输送方法,它们中的每一个均具有用于容纳多个托盘的容器并且具有较小的安装面积。电子部件传送装置(10)将作为容纳在作为容器的托盘(200)中的电子部件的IC装置(90)传送到检查IC装置(90)的电特性的检查单元(16)。安装部30被安装在其上的安装部30上,该安装部30安装有根据检查前的IC装置90的托盘200,该容纳部2容纳该托盘200并且使该托盘200沿水平轴和垂直轴移动。安装在安装单元30上的托盘5和将托盘200从集装箱2传送到升降机5的传送单元3,以及安装在安装单元30上的托盘200到检查单元16。当收纳IC装置90时,收纳机2配置在俯视时与收纳部25重叠的位置。 [选择图]图1

著录项

  • 公开/公告号JP2020118631A

    专利类型

  • 公开/公告日2020-08-06

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20190011960

  • 发明设计人 小谷 憲昭;

    申请日2019-01-28

  • 分类号G01R31/26;B65G1;

  • 国家 JP

  • 入库时间 2022-08-21 11:36:13

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