Electronic apparatus equipped with heat transfer components, the heat transfer components, and method of manufacturing a heat transfer components, as well as the method of cooling an electronic device

摘要

PURPOSE:To provide a heat-conduction part that can be easily replaced when an electronic part on a printed circuit board fails, and does not damage the electronic part, and an electronic device equipped with that heat-conduction part. CONSTITUTION:A gel-state resin 3 of the heat-conduction part 1 is fixed on one plane of a heat-radiation plate 2, and a part or the whole of the surface of the gel-state resin 3 is covered with silicon rubber 4 that prevents the permeation of liquid. And this heat-conduction part 1 is closely contacted with the electronic part 5 on the printed ci circuit board 7 to arrange it within the electronic device housing 8. Thus, the heat produced from the electronic part is radiated from the surface of the electronic device housing via the gel-state resin 3 and the radiation plate 2.