RESIN COMPOSITION FOR INTERLAYER INSULATION LAYER, RESIN FILM FOR INTERLAYER INSULATION LAYER, MULTILAYER PRINTED BOARD AND SEMICONDUCTOR PACKAGE

摘要

To provide a resin composition for interlayer insulation layer that is excellent in embedding property of a wiring pattern even when being highly filled with an inorganic filler, and a resin film for interlayer insulation layer, a multilayer printed wiring board and a semiconductor package using the resin composition for interlayer insulation layer.SOLUTION: There are provided a resin composition for interlayer insulation layer which contains (A) a thermosetting resin and (B) an inorganic filler, in which a content of (B) the inorganic filler in the resin composition for interlayer insulation layer is 55-90 vol.%, and a torque value Tafter 60 seconds from measurement start is 2.2 mN m or less when a torque value is temporally measured at 120°C using a gelation tester; and a resin film for interlayer insulation layer, a multilayer printed wiring board and a semiconductor package using the resin composition for interlayer insulation layer.SELECTED DRAWING: Figure 1