RESIN COMPOSITION FOR INTERLAYER INSULATION LAYER, RESIN FILM FOR INTERLAYER INSULATION LAYER AND MULTILAYER PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for interlayer insulation layer, having excellent heat resistance and dielectric properties, a low thermal expansion coefficient, and excellent adhesion to a conductor layer, and provide a resin film for interlayer insulation layer comprising the resin composition for interlayer insulation layer, and a multilayer printed board comprising the resin film for interlayer insulation layer.;SOLUTION: A resin composition for interlayer insulation layer comprises a novolac type epoxy resin (A) having at least one of structural units represented by specific formulas, and a cyanate resin (B).;SELECTED DRAWING: None;COPYRIGHT: (C)2016,JPO&INPIT