首页> 外国专利> MANUFACTURING METHOD OF CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE, STRETCHABLE WIRING SUBSTRATE, AND STRETCHABLE DEVICE

MANUFACTURING METHOD OF CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE, STRETCHABLE WIRING SUBSTRATE, AND STRETCHABLE DEVICE

机译:导电性基板,导电性基板,可伸缩的布线基板以及可伸缩的装置的制造方法

摘要

To provide a manufacturing method of a conductive substrate that includes a stretchable resin base material having a somewhat high tensile elastic modulus and that can manufacture a stretchable wiring substrate that is excellent in wiring stretchability.SOLUTION: There is disclosed a manufacturing method of a conductive substrate including a stretchable resin base material having a tensile elastic modulus of 10 to 50 MPa and a conductor layer provided on the stretchable resin base material. The disclosed method includes a step of forming a stretchable resin base material having the tensile elastic modulus of 10 MPa or more and less than 25 MPa such that the thickness is 40 μm or less, or a stretchable resin base material having the tensile elastic modulus of 25 MPa or more and 50 MPa or less such that the thickness is 25 μm or less, and a step of providing a conductor layer on the stretchable resin base material.SELECTED DRAWING: Figure 2
机译:本发明提供一种导电性基板的制造方法,该导电性基板包括具有较高拉伸弹性模量的伸缩性树脂基材,并且可以制造配线的伸缩性优异的伸缩性布线基板。包括拉伸弹性模量为10至50MPa的可拉伸树脂基材和设置在该可拉伸树脂基材上的导体层。所公开的方法包括以下步骤:形成拉伸弹性模量为10MPa以上且小于25MPa以使厚度为40μm以下的可拉伸树脂基础材料;或形成拉伸弹性模量为10MPa的可拉伸树脂基础材料。 25MPa以上且50 MPa以下以使厚度为25μm以下,以及在可拉伸树脂基材上提供导体层的步骤。图2

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号