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BMD evaluation method for silicon single crystal and manufacturing method for silicon single crystal

机译:硅单晶的BMD评估方法及硅单晶的制造方法

摘要

To provide a method for evaluating the BMD of a silicon single crystal, capable of preventing a defective from occurring in an epitaxial growth film deposition step used as the next step.SOLUTION: A method for evaluating the BMD of a silicon single crystal, capable of evaluating the BMD of the silicon single crystal pulled by the Czochralski method comprises: a step S1 of acquiring the pulling actual data of the pulled silicon single crystal; and a step S3 of setting a crystal length subjected to pulling speed moving average processing in a crystal length range having revealed BMD striations by the acquired pulling actual data to determine that the BMD striations are abnormal when a pulling speed variation range after the pulling speed moving average processing is equal to or more than a width in which the BMD striations occur.SELECTED DRAWING: Figure 3
机译:提供一种用于评估硅单晶的BMD的方法,该方法能够防止在下一步骤的外延生长膜沉积步骤中发生缺陷。评估通过切克劳斯基方法拉制的硅单晶的BMD包括:步骤S1,获取拉制的硅单晶的拉制实际数据;步骤S3,通过获取的提拉实际数据,在已经显示出BMD条纹的晶体长度范围内,对经过提拉速度移动平均处理的晶体长度进行设定,以判断出提拉速度移动后的提拉速度变化范围时,BMD条纹异常。平均处理等于或大于发生BMD条纹的宽度。选定的图形:图3

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