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Silicon carbide semiconductor device, power converter, and method for manufacturing silicon carbide semiconductor device

机译:碳化硅半导体器件,功率转换器以及制造碳化硅半导体器件的方法

摘要

The silicon carbide semiconductor device includes a trench gate type MOSFET and a trench type SBD. The gate trench (11) in which the gate electrode (13) of the MOSFET is embedded penetrates the source region (5) and the body region (4) and reaches the drift layer (3). The SBD trench (21) in which the Schottky electrode (22) of the SBD is buried penetrates the source region (5) and the body region (4) to reach the drift layer (3), and the side wall of the SBD trench (21) of the gate trench (11). It has a gentler slope than the side wall.
机译:碳化硅半导体器件包括沟槽栅型MOSFET和沟槽型SBD。嵌入有MOSFET的栅极(13)的栅极沟槽(11)穿过源极区(5)和主体区(4),并到达漂移层(3)。其中埋有SBD的肖特基电极(22)的SBD沟槽(21)穿透源极区域(5)和主体区域(4),以到达漂移层(3)和SBD沟槽的侧壁。栅沟槽(11)的(21)。它的倾斜度比侧壁小。

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