To provide a component mounting system, a substrate bonding system, a component mounting method and a substrate bonding method, in which the occurrence of poor bonding is suppressed.SOLUTION: A chip mounting system 1 includes: a stage 31 for holding a substrate WT; a head 33H for holding a chip CP; a chip humidity adjustment section for adjusting the humidity of a chip CP bonding surface CPf by cooling the chip CP, the chip humidity adjustment section being provided in the head 33H; a head drive section 36 which, while the humidity of the chip CP bonding surface CPT is maintained at a humidity within a preset reference humidity range by the chip humidity adjustment section, moves the head 33H closer to the stage 31 to bring the chip CP bonding surface CPf into contact with a mounting face WTf of the substrate WT and mounts the chip CP on the mounting face WTf of the substrate WT.SELECTED DRAWING: Figure 3
展开▼
