Glass-to-glass, glass-to-plastic and glass-to-ceramic / semiconductor bonding at room temperature

摘要

An apparatus for room temperature laser bonding comprising an x-axis motion stage (32) mounted to a base (33); a y-axis motion stage (34) mounted to the x-axis motion stage; a substrate alignment fixture (36) mounted on the y-axis motion stage, said alignment fixture adapted to align and secure at least two substrates with a mutual interface as a workpiece; a gantry (44) mounted to the base and supporting alignment optics (46) for a laser (14) to focus on the workpiece in the alignment fixture; and a controller (55) for translation of the x-axis motion stage and y-axis motion stage for motion of the focused laser on the workpiece.