首页> 外国专利> Light emitting device package having a black epoxy molding compound (EMC) body and lighting apparatus including the same

Light emitting device package having a black epoxy molding compound (EMC) body and lighting apparatus including the same

机译:具有黑色环氧模塑料(EMC)主体的发光器件封装和包括该发光器件封装的照明装置

摘要

A light emitting device of an embodiment includes a body including a black epoxy molding compound (EMC) including carbon black; first and second lead frames electrically separated from each other by the body; a light emitting device disposed above at least one of the first or second lead frame; and a molding member disposed above the body and the first and second lead frames so as to surround the light emitting device.
机译:实施例的发光器件包括:主体,其包括包含炭黑的黑色环氧模塑料(EMC);以及包含碳黑的环氧树脂。第一和第二引线框通过主体彼此电隔离;发光器件,其布置在第一或第二引线框架中的至少一个上方;模制构件设置在主体以及第一引线框架和第二引线框架的上方,以围绕发光器件。

著录项

  • 公开/公告号US10557596B2

    专利类型

  • 公开/公告日2020-02-11

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号US201716077360

  • 发明设计人 DONG WON LEE;SUNG HO PARK;MIN KYU LEE;

    申请日2017-02-10

  • 分类号H01L33/36;H01L33/40;H01L33/42;H01L33/48;H01L33/52;H01L33/56;H01L33/62;F21K9/90;F21K9;F21S2;H01L23;

  • 国家 US

  • 入库时间 2022-08-21 11:30:46

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号