首页> 外国专利> Light emitting device, light emitting device package including the device, and lighting apparatus including the package

Light emitting device, light emitting device package including the device, and lighting apparatus including the package

机译:发光器件,包括该器件的发光器件封装以及包括该封装的照明设备

摘要

A light emitting device includes a substrate; a light emitting structure disposed on the substrate; a first insulation layer disposed on the light emitting structure; a second insulation layer disposed on the first insulation layer; a first electrode and a second electrode electrically connected to the light emitting structure; a first pad electrically connected to the first electrode; and a second pad electrically connected to the second electrode.
机译:发光器件包括基板;和发光结构设置在基板上;第一绝缘层,设置在发光结构上;第二绝缘层,设置在第一绝缘层上;第一电极和第二电极电连接到发光结构;电连接到第一电极的第一焊盘;第二焊盘电连接到第二电极。

著录项

  • 公开/公告号US10651345B2

    专利类型

  • 公开/公告日2020-05-12

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号US201916540601

  • 发明设计人 SUNG HO JUNG;JIN KYUNG CHOI;SANG YOUL LEE;

    申请日2019-08-14

  • 分类号H01L33/40;H01L33/46;H01L33/62;H01L33/38;H01L33/42;H01L33/44;H01L33;H01L33/32;

  • 国家 US

  • 入库时间 2022-08-21 11:31:10

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号