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Silicon nitride sintered substrate, silicon nitride sintered substrate sheet, circuit substrate, and production method for silicon nitride sintered substrate

机译:氮化硅烧结基板,氮化硅烧结基板片,电路基板以及氮化硅烧结基板的制造方法

摘要

Provided is a large-sized silicon nitride sintered substrate and a method for producing the same. The silicon nitride sintered substrate has a main surface 101a of a shape larger than a square having a side of a length of 120 mm. A ratio dc/de of the density dc of the central area and the density de of the end area of the main surface 101a is 0.98 or higher. The void fraction vc of the central area of the main surface 101a is 1.80% or lower, and the void fraction ve of the end area is 1.00% or lower. It is preferred that the density dc of the central area is 3.120 g/cm3 or higher, the density de of the end area is 3.160 g/cm3 or higher, and a ratio ve/vc of the void fraction vc of the central area and the void fraction ve of the end area is 0.50 or higher.
机译:本发明提供大型的氮化硅烧结基板及其制造方法。氮化硅烧结基板的主表面 101 a 的形状大于边长为120mm的正方形。主表面 101 a 的中心区域的密度dc与端部区域的密度de之比dc / de为0.98或更高。主表面 101 a 的中央区域的空隙率vc为1.80%以下,端面的空隙率ve为1.00%以下。优选中心区域的密度dc为3.120g / cm 3 或更高,端部区域的密度de为3.160g / cm 3 或更高,中心区域的空隙率vc与端部区域的空隙率ve的比ve / vc为0.50以上。

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