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High electron mobility transistor with deep charge carrier gas contact structure

机译:具有深载流子接触结构的高电子迁移率晶体管

摘要

A method of forming a semiconductor device includes providing a heterojunction semiconductor body. The heterojunction semiconductor body includes a type III-V semiconductor back-barrier region, a type III-V semiconductor channel layer formed on the back-barrier region, and a type III-V semiconductor barrier layer formed on the back-barrier region. A first two-dimensional charge carrier gas is at an interface between the channel and barrier layers. A second two-dimensional charge carrier gas is disposed below the first two-dimensional charge carrier gas. A deep contact structure in the heterojunction semiconductor body that extends through the channel layer and forms an interface with the second two-dimensional charge carrier gas is formed. The first semiconductor region includes a first contact material that provides a conductive path for majority carriers of the second two-dimensional charge carrier gas at the interface with the second two-dimensional charge carrier gas.
机译:形成半导体器件的方法包括提供异质结半导体本体。异质结半导体本体包括III-V型半导体后阻挡区,形成在后阻挡区上的III-V型半导体沟道层,以及形成在后阻挡区上的III-V型半导体阻挡层。第一二维电荷载气在通道层和阻挡层之间的界面处。在第一二维电荷载气的下方布置第二二维电荷载气。在异质结半导体本体中形成延伸穿过沟道层并与第二二维电荷载流子气体形成界面的深接触结构。第一半导体区域包括第一接触材料,该第一接触材料在与第二二维电荷载气的界面处为第二二维电荷载气的多数载流子提供导电路径。

著录项

  • 公开/公告号US10516023B2

    专利类型

  • 公开/公告日2019-12-24

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AUSTRIA AG;

    申请/专利号US201815913284

  • 发明设计人 GILBERTO CURATOLA;OLIVER HAEBERLEN;

    申请日2018-03-06

  • 分类号H01L29/417;H01L29/20;H01L29/205;H01L21/74;H01L29/66;H01L29/778;

  • 国家 US

  • 入库时间 2022-08-21 11:28:05

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