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Wafer bonding apparatus and wafer bonding system including the same
Wafer bonding apparatus and wafer bonding system including the same
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机译:晶圆键合装置及包括该晶圆键合装置的晶圆键合系统
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摘要
Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.
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