首页> 外国专利> SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BASE MATERIAL

SHEET FOR SINTERING BONDING AND SHEET FOR SINTERING BONDING WITH BASE MATERIAL

机译:烧结粘结片和基材烧结粘结片

摘要

To provide a sheet for sintering bonding and a sheet for sintering bonding with a base material that are suited for properly supplying a material for sintering bonding to a face planned to be bonded of a bonding object. A sheet for sintering bonding 10 according to the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In the sheet for sintering bonding 10, the shear strength at 23° C., F (MPa), measured in accordance with a SAICAS method and the minimum load, f (μN), which is reached during an unloading process in load-displacement measurement in accordance with a nanoindentation method, satisfy 0.1≤F/f≤1. A sheet body X, which is a sheet for sintering bonding with a base material according to the present invention, has a laminated structure comprising a base material B and the sheet for sintering bonding 10.
机译:提供一种用于烧结结合的片材和用于与基材进行烧结结合的片材,其适合于适当地将用于烧结结合的材料适当地供应到结合对象的计划结合的面上。根据本发明的用于烧结粘结 10 的片材包括含有导电金属的可烧结颗粒和粘合剂组分。在烧结粘合片 10 中,根据SAICAS方法测量的在23℃下的剪切强度F(MPa)和在加工过程中达到的最小载荷f(μN)。根据纳米压痕法进行的载荷-位移测量中的卸载过程满足0.1≤F/f≤1。片状体X是根据本发明的用于与基材进行烧结结合的片,其具有包括基材B和用于烧结结合的片 10的层压结构。

著录项

  • 公开/公告号US2020294951A1

    专利类型

  • 公开/公告日2020-09-17

    原文格式PDF

  • 申请/专利权人 NITTO DENKO CORPORATION;

    申请/专利号US202016816763

  • 发明设计人 RYOTA MITA;TOMOAKI ICHIKAWA;

    申请日2020-03-12

  • 分类号H01L23;B29C41;B29C41/46;

  • 国家 US

  • 入库时间 2022-08-21 11:26:05

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