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APPARATUS AND METHODS FOR PLUG FILL DEPOSITION IN 3-D NAND APPLICATIONS
APPARATUS AND METHODS FOR PLUG FILL DEPOSITION IN 3-D NAND APPLICATIONS
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机译:3-D NAND应用中的填塞沉积的装置和方法
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摘要
An apparatus and a method for forming a 3-D NAND device are disclosed. The method of forming the 3-D NAND device may include forming a plug fill and a void. Advantages gained by the apparatus and method may include a lower cost, a higher throughput, little to no contamination of the device, little to no damage during etching steps, and structural integrity to ensure formation of a proper stack of oxide-nitride bilayers.
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