3-D NAND APPARATUS AND METHODS FOR PLUG FILL DEPOSITION IN 3-D NAND APPLICATIONS

摘要

An apparatus and method for forming a 3-D NAND device is disclosed. A method of forming a 3-D NAND device may include forming a plug filler and a void. The advantages obtained by the device and method are low cost, high throughput, little or no contamination of the device, little or no damage during the etching step, ensuring the formation of a suitable stack of oxide-nitride bilayers. May include structural integrity for