FEEDTHROUGH FABRICATION METHOD AND METHOD OF FABRICATING ENCAPSULATED ELECTRONIC DEVICE USING FEEDTHROUGH FABRICATED BY THE FEEDTHROUGH FABRICATION METHOD

摘要

A feedthrough fabrication method and a method of fabricating an encapsulated electronic device using a feedthrough fabricated by the feedthrough fabrication method. A high-strength feedthrough can be conveniently fabricated, and the position and shape of the feedthrough is freely modifiable. A feedthrough sheet, an insulating sheet, and a package sheet are stacked sequentially in a vertically downward direction. The feedthrough sheet, the insulating sheet, and the package sheet are diffusion-bonded. Holes are formed to penetrate through the package sheet and the insulating sheet. A plurality of feedthrough electrodes are formed by processing the feedthrough sheet, such that the feedthrough electrodes close the holes, respectively, and are spaced apart from each other.