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METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
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机译:带有接地共形屏蔽的晶圆级芯片级封装的方法
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摘要
Embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. In an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. A redistribution layer is over the first surface of the die, and the redistribution layer comprises a first conductive layer. In an embodiment, an under ball metallization (UBM) layer is over the redistribution layer, and a conductive shield is over the sidewall surfaces of the die and the second surface of the die. In an embodiment, the conductive shield is electrically coupled to the UBM layer.
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