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Hybrid integration of photonic chips with single-sided coupling

机译:光子芯片与单面耦合的混合集成

摘要

According to an example aspect of the present invention, there is provided a method for integrating photonic circuits comprising optical waveguides, where a smaller chip with at least one first photonic circuit is aligned and bonded on top of a larger chip having at least one second photonic circuit in order to couple light between optical waveguides on each chip, wherein optical coupling between the waveguides on said chips occurs from a single side of said smaller chip.
机译:根据本发明的示例方面,提供了一种用于集成包括光波导的光子电路的方法,其中将具有至少一个第一光子电路的较小芯片对准并结合在具有至少一个第二光子的较大芯片的顶部上为了在每个芯片上的光波导之间耦合光而进行电路耦合,其中所述芯片上的波导之间的光耦合从所述较小芯片的单侧发生。

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