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POST-LITHOGRAPHY DEFECT INSPECTION USING AN E-BEAM INSPECTION TOOL
POST-LITHOGRAPHY DEFECT INSPECTION USING AN E-BEAM INSPECTION TOOL
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机译:使用电子束检查工具的光刻后缺陷检查
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摘要
Methods for post-lithographic inspection using an e-beam inspection tool of organic extreme ultraviolet sensitive (EUV) sensitive photoresists generally includes conformal deposition of a removable metal carboxide or metal carboxynitride onto the relief image. The conformal deposition of the metal carboxide or metal carboxynitride includes a low temperature vapor deposition process of less than about 100° C. to provide a coating thickness of less than about 5 nanometers. Subsequent to e-beam inspection, the metal carboxide or metal carboxynitride coating is removed using a wet stripping process. Once stripped, the wafer can continue on to further process fabrication without being a sacrificial wafer.
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