THINNER COMPOSITION

摘要

A thinner composition is capable of reducing the amount of photoresist used in a reducing resist consumption (RRC) coating process, an edge bead removed (EBR) process or the like, and removing unnecessary photoresist on an edge portion or a backside portion of the wafer. The thinner composition includes C₁-C₁₀ alkyl C₁-C₁₀ alkoxy propionate, propylene glycol C₁-C₁₀ alkyl ether, and propylene glycol C₁-C₁₀ alkyl ether acetate.