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CONTACT ETCHING AND METALLIZATION FOR IMPROVED LED DEVICE PERFORMANCE AND RELIABILITY
CONTACT ETCHING AND METALLIZATION FOR IMPROVED LED DEVICE PERFORMANCE AND RELIABILITY
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机译:接触式蚀刻和金属化,可改善LED器件的性能和可靠性
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摘要
A light emitting device includes a vertical via through the P-type semiconductor layer and the active layer. Using a vertical via reduces quantum well damage, allows shortening of P-N spacing, and allows increased reflective area. A dielectric structure is formed in the via to provide a sloped wall that extends to an upper surface of the device. Another dielectric layer covers the upper surface and the sloped wall, and provides select contacts to the semiconductor layers. A metal layer is subsequently applied. Because the dielectric layers provide a continuous slope from the surface of the device, the metal layer does not include a vertical drop. Because the active layer does not extend into the via, the contact to the N-type semiconductor layer may be situated closer to the wall of the via, increasing the area available for a reflective layer.
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