首页> 外国专利> Semiconductor base substance having a boron containing buffer layer, semiconductor device including the same, and methods for manufacturing the semiconductor base substance and the semiconductor device

Semiconductor base substance having a boron containing buffer layer, semiconductor device including the same, and methods for manufacturing the semiconductor base substance and the semiconductor device

机译:具有含硼缓冲层的半导体基础物质,包括该缓冲层的半导体器件以及制造该半导体基础物质和半导体器件的方法

摘要

A semiconductor base substance includes: a substrate; a buffer layer which is made of a nitride semiconductor and provided on the substrate; and a channel layer which is made of a nitride semiconductor and provided on the buffer layer, wherein the buffer layer includes: a first region which is provided on the substrate side and has boron concentration higher than acceptor element concentration; and a second region which is provided on the first region, and has boron concentration lower than that in the first region and acceptor element concentration higher than that in the first region. As a result, the semiconductor base substance which can obtain a high pit suppression effect while maintaining a high longitudinal breakdown voltage is provided.
机译:半导体基础物质包括:基板;由氮化物半导体制成并设置在基板上的缓冲层;缓冲层包括设置在基板侧且硼浓度比受体元素浓度高的第一区域;和由氮化物半导体构成的沟道层,其设置在缓冲层上。第二区域设置在第一区域上,该第二区域的硼浓度低于第一区域的硼浓度,并且受主元素浓度高于第一区域的硼浓度。结果,提供了在保持高的纵向击穿电压的同时可以获得高的凹坑抑制效果的半导体基础物质。

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