首页>
外国专利>
WAFER BONDING APPARATUS AND WAFER BONDING SYSTEM USING THE SAME
WAFER BONDING APPARATUS AND WAFER BONDING SYSTEM USING THE SAME
展开▼
机译:晶圆键合装置和使用该晶圆键合系统的晶圆键合系统
展开▼
页面导航
摘要
著录项
相似文献
摘要
A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.
展开▼