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Methods for Improving Uniformity in Substrates in a Lithographic Process
Methods for Improving Uniformity in Substrates in a Lithographic Process
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机译:在光刻工艺中改善基板均匀性的方法
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摘要
A method of processing a substrate having a metal oxide resist layer formed thereon is provided, the method including the steps of: exposing the substrate to patterning radiation to form a pattern including a plurality of features in the metal oxide resist layer; exposing a portion of the substrate including at least one of said features to conditioning radiation thereby causing shrinkage of the metal oxide resist layer in said portion. Computer programs which cause a computer apparatus to perform the above method and computer program products having such computer programs stored thereon are also provided, as are apparatuses, such as lithographic apparatuses, having a processor adapted to carry out the above method or run the above program. The methods and apparatuses can lead to an improvement in critical dimension uniformity.
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