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Methods for Improving Uniformity in Substrates in a Lithographic Process

机译:在光刻工艺中改善基板均匀性的方法

摘要

A method of processing a substrate having a metal oxide resist layer formed thereon is provided, the method including the steps of: exposing the substrate to patterning radiation to form a pattern including a plurality of features in the metal oxide resist layer; exposing a portion of the substrate including at least one of said features to conditioning radiation thereby causing shrinkage of the metal oxide resist layer in said portion. Computer programs which cause a computer apparatus to perform the above method and computer program products having such computer programs stored thereon are also provided, as are apparatuses, such as lithographic apparatuses, having a processor adapted to carry out the above method or run the above program. The methods and apparatuses can lead to an improvement in critical dimension uniformity.
机译:提供一种处理其上形成有金属氧化物抗蚀剂层的基板的方法,该方法包括以下步骤:将所述基板暴露于图案化辐射以在所述金属氧化物抗蚀剂层中形成包括多个特征的图案;使包括至少一个所述特征的衬底的一部分暴露于调节辐射下,从而导致所述部分中的金属氧化物抗蚀剂层收缩。还提供了使计算机设备执行上述方法的计算机程序以及在其上存储了这种计算机程序的计算机程序产品,以及诸如光刻设备之类的,具有适于执行上述方法或运行上述程序的处理器的设备。 。该方法和设备可以导致临界尺寸均匀性的改善。

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