HIGHLY THERMAL CONDUCTIVE ELECTRICALLY-INSULATIVE COMPOSITE MEMBER AND SEMICONDUCTOR MODULE

摘要

This highly thermal conductive electrically-insulative resin composite member 1 is provided with: a main layer 10 which includes an electrically-insulative resin material 11 and diamond pieces 13 and in which said diamond pieces 13 are arranged in such a manner as to penetrate said layer in the thickness direction and to be exposed out of the surface of the said layer; and protective joining layers 15 which are disposed on the obverse surface and the reverse surface of the main layer 10 and which are composed of a resin composite material that is obtained by dispersing an electrically conductive filler made of a metal in a resin material and that has a thermal conductivity of at least 5 W/m·K, wherein, no delamination arises between the main layer 10 and the protective joining layers 15 when said composite member is subjected to a heat cycle test, no electric insulation breakdown occurs when the composite member is subjected to a withstand voltage test following the heat cycle test, and, after the heat cycle test and the withstand voltage test, the composite member has a thermal conductivity of at least 10 W/m·K.