HIGH THERMAL CONDUCTIVE INSULATING RESIN COMPOSITE MEMBER AND SEMICONDUCTOR MODULE

摘要

To provide a high thermal conductive insulating resin composite member having required insulation and high thermal conductivity even after a heat cycle test under pressure.SOLUTION: A high thermal conductive insulating resin composite 1 includes: a main layer 10 including an insulating resin material 11 and a diamond piece 13, the diamond piece 13 disposed so as to penetrate the layer in the thickness direction, and the main layer being exposed from the surface of the layer; and a protective bonding layer 15 disposed on the front surface and the back surface of the main layer 10, having a metal conductive filler dispersed in a resin material, and formed of a resin composite material having a thermal conductivity of 5 W/m K or more, in which no peeling occurs between the main layer 10 and the protective bonding layer 15 in a heat cycle test, and no dielectric breakdown occurs even when the withstand voltage test is performed after the heat cycle test, and the thermal conductivity after the heat cycle test and the withstand voltage test are performed is 10 W/m K or more.SELECTED DRAWING: Figure 1