CHEMICAL-MECHANICAL POLISHING COMPOSITION, CHEMICAL-MECHANICAL POLISHING SLURRY, AND METHOD FOR POLISHING SUBSTRATE

摘要

Provided are a chemical-mechanical polishing composition, a chemical-mechanical polishing slurry, and a method for polishing a substrate, which are capable of implementing a polishing rate equivalent to or higher than that of a conventional abrasive even when a total metal content is reduced, or implementing a polishing rate that is significantly higher than that of the conventional abrasive when the same total metal content as prior art is used. The chemical-mechanical polishing composition comprises: an iron-based metal catalyst; and a magnesium-based metal catalyst, wherein the metal content of the iron-based metal catalyst is greater than or equal to the metal content of the magnesium-based metal catalyst with respect to the total content of the metal catalysts.