RESIN COMPOSITION FOR DICING FILM SUBSTRATE, DICING FILM SUBSTRATE, AND DICING FILM

摘要

The purpose of the present invention is to provide a resin composition for a dicing film substrate for producing a dicing film having both high strength and high thermal shrinkage. Provided are: a resin composition for a dicing film substrate, the resin composition containing 30-90 parts by mass of an ionomer (A) of an ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer and 10-70 parts by mass of an ethylene copolymer (B) (with respect to 100 parts by mass in total of component (A) and component (B)), and having a Vicat softening point of less than 50°C as defined according to JIS K7206-1999; a dicing film substrate using the resin composition; and a dicing film using the resin composition.